Friday, January 8, 2010

Chemical Mechanical Planarization of Microelectronic Materials Download

Chemical Mechanical Planarization of Microelectronic Materials
Author: Joseph M. Steigerwald
Edition: 1
Binding: Hardcover
ISBN: 0471138274



Chemical Mechanical Planarization of Microelectronic Materials


Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. Download Chemical Mechanical Planarization of Microelectronic Materials from rapidshare, mediafire, 4shared. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now.

Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage Search and find a lot of engineering books in many category availabe for free download.

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Download Chemical Mechanical Planarization of Microelectronic Materials


Download Chemical Mechanical Planarization of Microelectronic Materials engineering books for free. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication

Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage

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Microelectronic Applications of Chemical Mechanical Planarization


An authoritative, systematic, and comprehensive description of current CMP technology

Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC

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